COOL-SILVER™ 3.5 Gram Syringe & COOL-TIME™ 30 mL Bottle

AI Technology has more than 25 years of experience and successes in helping military, aerospace, computer, and super-computer manufacturers with thermal compound and thermal interface materials for building some of the most reliable electronic devices and computers. AIT is now reaching out to serve the consumer PC community with it's COOL-SILVER™ state-of-the-art thermal compound and COOL-TIME™ thermal interface cleaner.

COOL-SILVER™ has a measurable performance advantage in dropping the semiconductor junction temperature with the same heat-sink and CPU. It contains more than 90% silver by weight, 0% silicone, and is RoHS compliant. The thermal resistance is lower than the known “industry standard” of <0.0045°C-in²/Watt @ 0.001 inch interface layer thickness. Side by side comparison with the best known thermal compound / thermal grease for CPU applications demonstrated the superior performance of COOL-SILVER™.

COOL-TIME™ removes all thermal interface material with ease and does not require a secondary solution to neutralize any residual acidic or citric compounds. Just apply a few drops of COOL-TIME™ on the thermal material, wait 10 seconds, and gently remove the material with a lint free cloth. You are now ready for a new application of COOL-SILVER™.

Recent independent laboratory reviews below show just how well our COOL-SILVER™ thermal compound performs relative to similar products in the high-end overclocking market.

COOL-SILVER™, unlike some of the earlier generations of silver greases, will not separate, run, migrate, or bleed. Even though the thermal conductivity comes from the highly packed micronized pure silver particulate, it is not electrically conductive.